Chemelex DX-4—040% potassium carbonate with additives for extended bath life, higher yields and faster speeds.
Chemelex DX-45—High loading formula specifically
designed for use in feed and bleed systems. Ideal for LPI.
Chemelex FINE LINE 40—40% potassium carbonate with no sodium ions for use with hard water. Additives for extended bath life.
Chemelex Sodium Carbonate Solution—One-part concentrate formulated to develop fully aqueous dry film photoresist.
Chemelex ADF-25—Latest generation of
resist strippers for outstanding performance on today's newest dry films.
Contains enhanced anti-tarnish package for a bright copper appearance. Excellent
Chemelex ADF-25C—Concentrated version of ADF-25.
Chemelex ADF-30—Strong, consistent performance
on a wide variety of photoresists. More anti-tarnish for a brighter copper
finish. Large particle size for easy filtration.
Chemelex ADF-35—Low VOC formula for inner
layer stripping. Contains anti-tarnish for bright, uniform copper appearance
and produces large particles for easy filtration and prolonged bath life.
Chemelex ADF-202—Stripper for resists and photomasks applied over leveled solder for deep gold selective plating.
Chemelex DUAL STRIP—Highly effective for stripping a combination of dry film and screen ink resists. Consistently maintains a long effective bath life. BAT* package available.
Chemelex MICROSTRIP—Excellent for breaking aqueous resist into very small particles for fine line applications.
Chemelex MICROSTRIP 2000—Semi-aqueous stripper with additives for increased penetration into two to three mil lines and spaces.
Chemelex ULTRASTRIP—Highly concentrated
and highest loading of the resist strippers. BAT* package available.